1. FR-4 PCB up to 30 Layers, 0.3-5mm thick, 1-5 oz copper.
High Tg 170, Differential /single impedance contorl at designated
1+N+1 HDI, laser drill, Blind/buried vias
Half hole, Via in pad, peelable mask
ENIG, HASL, Immersion Silver, OSP, Gold finger.
Small to medium volume, No MOQ.
Quick turn around prototypes.
mixed material PCB (ROGERS + FR4, Aluminium +FR4)
2. MCPCB includes aluminium backed of China-source, Bergquist
T-CLAD, Laird 1KA,
Japanese material, Taiwan material. Copper backed and Stainless
steel backed material. Thermal conductivity normal at 0.8-1.3W/mk,
Higher to 2W/mk, 3W/mk
3. Microwave PCB includes PTFE, RO4350B/4003C, Duriod6002 and
4. XPC(94HB), FR-1(94V0), single sided PCB, Carbon through
Silver through hole(STH), large volume. OSP, Electro Gold finish,
5. CEM-1 and CEM-3, Single sided, Carbon through holes(CTH), Silver
through hole(STH), large volume. OSP, Electro gold, HASL technique.
6. SMT solder paste stencil, laser cut, aluminium framed, 12" x 12"
to 28" x 28" size